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Future Scope of Silicone Polymer based Functionalized Nanocomposites for Device Packaging: A Mini Review

Satyajit Gupta, Praveen C Ramamurthy and Giridhar Madras

Organic electronic devices, such as conducting polymer and/or perovskite based solar cells are highly promising and emerging, but they are highly unstable in the presence of moisture and oxygen. It is important to protect these devices from these deterrent gases by using a suitable encapsulant and to improve the lifetime of these promising devices. “Silicone polymer” impregnated with suitable functionalized nano fillers/moisture or oxygen scavengers can be potentially used for sensitive organic device encapsulation applications, where a combined property of flexibility, thermal stability, transparency, and low moisture permeation is critical. Suitable fillers can also enhance the thermomechanical properties of silicone polymers, which is also important for hermitic sealing applications. Silicone polymer have a wide range of applications in electronic, mechanical, and biological industries, due to their flexibility over a broad temperature window, resiliency, transparency, superior thermal stability, resistant to aging and degradation from sunlight. This polymer also coats a surface conformally, having moisture resistance property and inertness. In this minireview, functionalized composites based on silicone polymers, which have been developed for the potential organic device encapsulation application, has been discussed. In addition to that, future direction towards the fabrication of new functionalized nanocomposites, based on silicone polymers is also discussed briefly.